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seminars:seminar_11_04_05 [2017/09/20 22:02] (current)
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 +======Statistical Thermal Evaluation and Mitigation for 3D Chip-Multiprocessors======
 +Tuesday Apr. 5, 2011\\
 +Hamerschlag Hall D-210\\
 +4:00 pm\\
 +**Da-Cheng Juan**\\
 +Carnegie Mellon University\\
 +Thermal issues have become critical roadblocks for achieving highly
 +reliable three-dimensional (3D) integrated circuits. The presence of
 +process variations further deteriorates these problems. In this talk,
 +we provide both the evaluation and mitigation of the impact of leakage
 +power variations on the temperature profile of 3D Chip-Multiprocessors
 +(CMPs). Furthermore,​ we also propose a methodology to predict the
 +maximum temperature,​ based on which an effective tier-stacking
 +algorithm is proposed and evaluated. Experimental results show that
 +the proposed prediction achieves less than 2% error rate, while the
 +tier-stacking algorithm significantly improves the thermal yield from
 +44.4% to 81.1% for a 4-tier 3D CMP.
 +Da-Cheng Juan received his B.S. and M.S. degrees in Computer Science
 +department at National Tsing Hua University in 2005 and 2007,
 +respectively. ​ He is currently a Ph.D. student in the Electrical and
 +Computer Engineering department at Carnegie Mellon University, advised
 +by Prof. Diana Marculescu. ​ His research interests include
 +reliability-aware 3D architectures,​ machine learning, low-power
 +VLSI/EDA technologies,​ and algorithm designs.\\
 +**[[seminars| Back to the seminar page]]**