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 +======Emerging 3D Stacking and Non-volatile memory technologies and their impact on Computer Design======
 +Wednesday April 28, 2010\\
 +4:00 pm\\
 +**[[http://​www.cse.psu.edu/​~yuanxie/​|Yuan Xie]]**\\
 +Pennsylvania State University \\
 +The growing complexity of advanced deep-submicron technology used to
 +build computing systems has resulted in many design challenges for
 +future ​ computing systems, such as power limits, limited communication
 +bandwidth and latency, and reduced system reliability. At the same
 +time, various disruptive emerging technologies promise dramatically
 +improved performance at the device level. How likely are these
 +improvements and what impact will they have at the circuit and
 +architecture level? In this talk, I will present an overview of two
 +emerging technologies: ​ 3D integration and new non-volatile memory
 +technologies. I will describe the fundamentals and current status of
 +each technology, introduce the advantages of the technologies,​ and
 +discuss the design challenges inherent in adoption of the
 +technologies,​ and give an overview of the research activities in my
 +group. A preview of these two research areas can be found at
 +http://​www.cse.psu.edu/​~yuanxie/​3d.html and
 +Prof. Yuan Xie received the B.S. degree from Tsinghua University ​ and
 +the M.S. and Ph.D. degrees in electrical engineering from Princeton
 +University. He is currently Associate Professor in  CSE department at
 +the Pennsylvania State University. Before joining Penn State in Fall
 +2003, he was with IBM Microelectronic Division'​s Worldwide Design
 +Center. Prof. Xie is a recipient of the NSF CAREER award, the SRC
 +Inventor Recognition Award, IBM Faculty Award, several Best Paper
 +Award  and Best Paper Award Nominations ​ at IEEE/ACM conferences. He
 +has published more than 100  papers in journals and refereed
 +conference proceedings,​ in the area of EDA, computer architecture,​
 +VLSI circuit designs, and embedded systems. His current research
 +projects focus on 3D IC design and emerging memory technologies. He is
 +currently Associate Editor for ACM Journal of Emerging Technologies in
 +Computing Systems (JETC), IEEE Transactions on Very Large Scale
 +Integration Systems (TVLSI), IEEE Transactions on Computer Aided
 +Design of Integrated Circuits (TCAD), IEEE Design and Test of
 +Computers, IET Computers and Digital Techniques (IET CDT). He is ACM
 +Distinguished Speaker. He is also a co-editor of the first 3D IC book
 +on EDA, Design and Architecture (Springer 2009).
 +**[[seminars| Back to the seminar page]]**